Tangible, Embedded, and Embodied Interactions Conference

Yokohama, Japan
Mar. 20-23, 2017
Conference Website

TEI 2017 is the 11th annual conference dedicated to presenting the latest results in tangible, embedded, and embodied interaction. The ACM International Conference on Tangible, Embedded, and Embodied Interaction (TEI) addresses issues of human-computer interaction, novel tools and technologies, interactive art, and user experience. The work presented at TEI has a strong focus on how computing can bridge atoms and bits into cohesive interactive systems.

Sherry HsiFoldMecha: Exploratory Design and Engineering of Mechanical Papercraft

Hyunjoo Oh, Jeeeun Kim, Cory Morales, Mark Gross, Michael Eisenberg, Sherry Hsi

Tuesday, March 21, 1:30 PM – 5:30 PM
Wednesday, March 22, 3:30 PM – 4:30 PM

We present FoldMecha, a computer-aided design (CAD) system for exploratory construction of mechanical papercraft. FoldMecha enables students to design their own movements with simple mechanisms by modifying parameters and build physical prototypes. This paper describes the system, as well as associated prototyping methods that make the construction process easier and more adaptable to widely different creations. The paper also discusses a week-long workshop that we held with six teenagers using FoldMecha. The teens successfully designed and built their own mechanisms, and adapted them to a variety of creations. Throughout the workshop, they progressively achieved an advanced level of skill and understanding about mechanical movements.

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